Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus-containing bismaleimide and epoxy resins

被引：34
作者：
Jeng, RJ [1 ]
Lo, GS
Chen, CP
Liu, YL
Hsiue, GH
Su, WC
机构：
[1] Natl Chung Hsing Univ, Dept Chem Engn, Taichung 402, Taiwan
[2] Chung Yuan Christian Univ, Dept Chem Engn, Chungli 320, Taoyuan, Taiwan
[3] Chung Shan Inst Sci & Technol, Taoyuan 325, Taiwan
来源：
POLYMERS FOR ADVANCED TECHNOLOGIES | 2003年 / 14卷 / 02期
关键词：
bismaleimide; epoxy; thermosets; blends; thermal properties;
D O I：
10.1002/pat.343
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Epoxy resins modified by an organosoluble phosphorus-containing bismaleimide (3,3'-bis(maleimidophenyl) phenylphosphine oxide, BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212degreesC, thermal stability at temperatures over 350degreesC, and excellent flame retardancy with Limited oxygen index (LOT) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright (C) 2003 John Wiley Sons, Ltd.
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页码：147 / 156
页数：10
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