Ion-bombardment effects on PtSi/n-Si Schottky contacts studied by ballistic electron emission microscopy

被引:0
作者
Ru, GP [1 ]
Qu, XP
Zhu, SY
Li, BZ
Detavernier, C
Van Meirhaeghe, RL
Cardon, F
Donaton, RA
Maex, K
机构
[1] Fudan Univ, Dept Elect Engn, Shanghai 200433, Peoples R China
[2] State Univ Ghent, Dept Solid State Sci, B-9000 Ghent, Belgium
[3] IMEC, B-3001 Louvain, Belgium
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2000年 / 18卷 / 04期
关键词
D O I
10.1116/1.1305269
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ballistic electron emission microscopy has been used to study physical damage effects on PtSi/n-Si Schottky contacts. The physical damages are introduced into Si substrates by ion bombardment with well-defined energies in an ion-milling process. Schottky barrier height (SBH) distribution is measured on the subsequently formed PtSi/n-Si Schottky diodes. The results show that mean SBH decreases with ion energy in a square-root relation. A simple SBH model is developed to consider image-force lowering effect for a semiconductor with a step-function distribution of donor concentration. The model is successfully used to explain quantitatively the experimental relation between SBH and ion energy. (C) 2000 American Vacuum Society. [S0734-211X(00)02804-3].
引用
收藏
页码:1942 / 1948
页数:7
相关论文
共 20 条
[1]   MODIFICATION OF SCHOTTKY BARRIERS IN SILICON BY REACTIVE ION ETCHING WITH NF3 [J].
ASHOK, S ;
CHOW, TP ;
BALIGA, BJ .
APPLIED PHYSICS LETTERS, 1983, 42 (08) :687-689
[2]   OBSERVATION OF INTERFACE BAND-STRUCTURE BY BALLISTIC-ELECTRON-EMISSION MICROSCOPY [J].
BELL, LD ;
KAISER, WJ .
PHYSICAL REVIEW LETTERS, 1988, 61 (20) :2368-2371
[3]  
CHAPMAN B, 1980, GLOW DISCHARGE PROCE, P395
[4]   GROWTH AND ELECTRICAL CHARACTERISTICS OF PALLADIUM SILICIDE CONTACTS ON DRY-ETCHED SILICON SURFACES [J].
CLIMENT, A ;
FONASH, SJ .
JOURNAL OF APPLIED PHYSICS, 1984, 56 (04) :1063-1069
[5]   BALLISTIC ELECTRON-EMISSION MICROSCOPY INVESTIGATION OF SIGE NANOSTRUCTURES FABRICATED USING REACTIVE-ION ETCHING [J].
COUILLARD, JG ;
DAVIES, A ;
CRAIGHEAD, HG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1992, 10 (06) :3112-3115
[6]   Electrical characterization and annealing behavior of defect introduced in Si during sputter etching in an Ar plasma [J].
Deenapanray, PNK ;
Auret, FD ;
Myburg, G .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (04) :1873-1880
[7]   Formation of ultra-thin PtSi layers with a 2-step silicidation process [J].
Donaton, RA ;
Jin, S ;
Bender, H ;
Zagrebnov, M ;
Baert, K ;
Maex, K ;
Vantomme, A ;
Langouche, G .
MICROELECTRONIC ENGINEERING, 1997, 37-8 (1-4) :507-514
[8]   AN OVERVIEW OF DRY ETCHING DAMAGE AND CONTAMINATION EFFECTS [J].
FONASH, SJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (12) :3885-3892
[9]   ELECTRICAL DEFECTS IN SILICON INTRODUCED BY SPUTTERING AND SPUTTER-ETCHING [J].
GRUSELL, E ;
BERG, S ;
ANDERSSON, LP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (07) :1573-1576
[10]   TECHNOLOGY AND APPLICATIONS OF BROAD-BEAM ION SOURCES USED IN SPUTTERING .2. APPLICATIONS [J].
HARPER, JME ;
CUOMO, JJ ;
KAUFMAN, HR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 21 (03) :737-756