Incorporation effects of Si in TiCx thin films

被引:17
作者
Tengstrand, O. [1 ]
Nedfors, N. [2 ]
Alling, B. [1 ]
Jansson, U. [2 ]
Flink, A. [1 ,3 ]
Eklund, P. [1 ]
Hultman, L. [1 ]
机构
[1] Linkoping Univ, Dept Phys Chem & Biol IFM, Thin Film Phys Div, SE-58183 Linkoping, Sweden
[2] Uppsala Univ, Angstrom Lab, Dept Chem, SE-75121 Uppsala, Sweden
[3] Impact Coatings AB, SE-58216 Linkoping, Sweden
基金
瑞典研究理事会;
关键词
First-principles calculations; Thin films; Ti-C; Silicon; Physical vapor deposition (PVD); MECHANICAL-PROPERTIES; TRIBOLOGICAL BEHAVIOR; TI3SIC2; COATINGS; METALS; STABILITY; DIFFUSION; PHASES;
D O I
10.1016/j.surfcoat.2014.08.064
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Ti-Si-C thin films with varying Si content between 0 to 10 at.% were deposited by DC magnetron sputtering from elemental targets. The effects on microstructure and lattice parameters were investigated using x-ray diffraction, x-ray photoelectron spectroscopy, transmission electron microscopy, and first-principles calculations. The results show that the growth of pure TiCx onto Al2O3(0001) substrates at a temperature of 350 degrees C yields (111) epitaxial and understoichiometric films with x similar to 0.7. For Si contents up to 4 at.%, the TiCx epitaxy is retained locally. Si starts to segregate out from the TiCx to column boundaries at concentrations between 1 and 4 at.%, and causes a transition from epitaxial to polycrystalline growth above 4 at.%. Eventually, the top part of the films form a nanocomposite of crystalline TiC grains surrounded by amorphous SiC and C for Si contents studied up to 10 at.%. The results show that Si takes the place of carbon when incorporated in the TiC lattice. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:392 / 397
页数:6
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