Prospects of Thermoelectric Energy Harvesting in 3D ICs

被引：0

作者：

Zhou, Shi-Yun ^{[1
]}

Ong, Wee-liat ^{[2
]}

Li, Er-Ping ^{[1
]}

机构：

[1] Zhejiang Univ, Key Lab AMESS, Hangzhou, Zhejiang, Peoples R China

[2] Zhejiang Univ, ZJU UIUC Inst, Coll Energy Engn, Hangzhou, Zhejiang, Peoples R China

来源：

2019 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM (IWS 2019) | 2019年

基金：

中国国家自然科学基金;

关键词：

thermoelectric energy harvesting; thermoelectric energy generator (TEG); 3D ICs;

D O I：

10.1109/ieee-iws.2019.8804077

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D ICs integration dissipates much higher power in the form of heat than conventional ICs. In this paper, we explore an idea of harvesting this waste heat using thermoelectrics (TE). We present a complete system of a thermoelectric energy generator (TEG) with vertical and planar TE structures. The preliminary output characteristics of the planar structure and vertical structure are explored.

引用

页数：3

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