The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

被引：72

作者：

Liu, Weiping ^{[1
]}

Lee, Ning-Cheng ^{[1
]}

机构：

[1] Indium Corp Amer, Clinton, NY 13323 USA

来源：

JOM | 2007年 / 59卷 / 07期

关键词：

Silver alloys - Soldered joints - Creep resistance - Microstructure - Ternary alloys - Reliability - Copper alloys - Lead-free solders - Tin alloys - Drops;

D O I：

10.1007/s11837-007-0085-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However BGA and CSP solder joints using SAC alloys are fragile and prone to Premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.

引用

页码：26 / 31

页数：6

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