Remote heat sink concept for high power heat rejection

被引:9
|
作者
Webb, RL [1 ]
Yamauchi, S
Denko, S
Tochigi, KK
机构
[1] Penn State Univ, Dept Mech Engn, University Pk, PA 16802 USA
[2] Showa Denko Co Ltd, Oyama Technol Ctr, Oyama, Tochigi, Japan
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2002年 / 25卷 / 04期
关键词
cooling device; heat exchanger; heat sink; thermal resistance; thermo-syphon;
D O I
10.1109/TCAPT.2003.809109
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper addresses heat rejection concepts intended to reject 100 W (or more) from the CPU of a desktop computer or server. A high-performance, air-cooled thermo-syphon heat rejection system is described that meets the goal. This concept is believed to represent the highest performance that has been reported for an air-cooled heat rejection system. A working fluid is boiled in a small chamber mounted on the CPU, and the vapor is condensed in the tubes of the remotely located air-cooled condenser. The air-cooled heat exchanger provides much higher performance than is obtainable with conventional "round-tube" technology. The boiling design is compared with other, systems that have been proposed, e.g., liquid or two-phase cooling in micro-channels, and is shown to provide better performance. The heat exchange technology may also be applied to refrigerated cooling.
引用
收藏
页码:608 / 614
页数:7
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