Three-dimensional integration technology for real time micro-vision system

被引：5
作者：
Kurino, H
Matsumoto, T
Yu, KH
Miyakawa, N
Itani, H
Tsukamoto, H
Koyanagi, M
机构：
来源：
SECOND ANNUAL IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON, 1997 PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/ICISS.1997.630262
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed.
引用
收藏
页码：203 / 212
页数：10
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