Planar inductors for high frequency DC-DC converters using microwave magnetic material

被引：0

作者：

Martin, Christian ^{[1
]}

Rousseau, Jean-Jacques ^{[2
]}

Allassem, Desire ^{[2
]}

Menager, Ludovic ^{[3
]}

Bley, Vincent ^{[3
]}

Allard, Bruno ^{[4
]}

Tournier, Dominique ^{[4
]}

Soueidan, Maher ^{[4
]}

Lembeye, Jean-Yves ^{[5
]}

机构：

[1] Univ Lyon 1, CNRS, UMR5005, Ampere Lab, F-69622 Lyon, France

[2] Univ St Etienne, Univ Lyon 1, DIOM, St Etienne, France

[3] Univ Toulouse 3, Univ Toulouse, CNRS, UMR 5213, F-31062 Toulouse, France

[4] Univ Lyon 1, CNRS, UMR 5005, INSA Lyon, F-69621 Villeurbanne, France

[5] CNRS, UMR 5269, G2 Lab, F-38402 St Martin Dheres, France

来源：

2009 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION, VOLS 1-6 | 2009年

关键词：

Inductance; Wafer-scale integration; Magnetic cores; Hybrid integrated circuit fabrication; DC-DC power conversion;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Paper presents simulation and primary experimental results about the fabrication of planar inductances for monolithic DC/DC converters in System-In-Package environment. A microwave magnetic material (YIG) and electroplated copper winding are proposed. A low-cost manufacturing process is proposed that uses dry film instead of UV SU8 resin. Literature details similar manufacturing processes but the proposed magnetic material enables to operate in the 100MHz range. Simulation results based on HFSS and Flux2D simulators present the sensitivity of the inductor to geometrical parameters. Samples have been fabricated for a 1W, Vin=3.6V, Vout=1V converter and a switching frequency above 100MHz. An optimized 25nH inductor with expected 50m Omega R-DC, 3mm(2) has been designed. Primary results indicate that the nH/(m Omega.mm(2)) metric is promising and truly comparable to already published results.

引用

页码：1817 / +

页数：2

共 10 条

[1] An Inductive Down Converter System-in-Package for Integrated Power Management in Battery-powered Applications [J].

Bergveld, H. J. ;

Karadi, R. ;

Nowak, K. .

2008 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-10, 2008, :3335-3341

[2]

CHESNEAU D, 2008, 1 IEEE INT WORKSH PO

[3]

DING H, 2007, Patent No. 7271693

[4]

LEE DW, 2008, THESIS STANFORD U

[5]

ODONNELL T, 2008, 1 IEEE INT WORKSH PO

[6] Chip-level integration of RF MEMS on-chip inductors using UV-LIGA technique [J].

Park, Daniel Sang-Won ;

Jeong, Youngkyun ;

Lee, Jeong-Bong ;

Jung, Sungyong .

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2008, 14 (9-11) :1429-1438

[7]

SUN J, 2008, IEEE T VLSI SYSTEMS

[8] Micro-inductors integrated on silicon for power supply on chip [J].

Wang, Ningning ;

O'Donnell, Terence ;

Roy, Saibal ;

McCloskey, Paul ;

O'Mathuna, Cian .

JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2007, 316 (02) :E233-E237

[9] A high-efficiency DC-DC converter using 2 nH integrated inductors [J].

Wibben, Josh ;

Harjani, Ramesh .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2008, 43 (04) :844-854

[10]

2008, 1 IEEE INT WORKSH PO

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