A Review of Thermal Analysis Methods in Electromagnetic Devices

被引：0

作者：

Mohammadi, Rahim ^{[1
]}

Mozaffar, Alireza ^{[2
]}

Mardaneh, Mohammad ^{[1
]}

Darabi, Ahmad ^{[2
]}

机构：

[1] Shiraz Univ Technol, Fac Elect Engn, Shiraz, Iran

[2] Islamic Azad Univ, Fac Elect & Comp, Sci & Res, Tehran, Iran

来源：

2014 IEEE 23RD INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (ISIE) | 2014年

关键词：

finite element analysis; lumped parameter model; multiphysics modeling; thermal analysis; thermal network; PERMANENT-MAGNET MACHINES; DESIGN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reviews different methods of thermal analysis, highlighting advantages, drawbacks, and limits. It represents the basics for both analytical methods and numerical ones; which the analytical method is discussed more in detail, including thermal coefficients relevant issues. Also, different applications are investigated, and related analytical and numerical techniques are represented. The aim is to give an exhaustive treatise of the various aspects concerning the thermal analysis. The key issues in thermal problem are represented. This paper is aimed as a tutor for designers who may be unfamiliar with this particular type of concepts; also they are leaded to some useful references for more details and investigation.

引用

页码：739 / 744

页数：6

共 18 条

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