Enhanced thermoelectric properties of p-type Bi0.5Sb1.5Te3 bulk alloys by electroless plating with Cu and annealing

被引：29
作者：
Huang, Zhongyue [1 ]
Dai, Xueting [1 ]
Yu, Yuan [1 ]
Zhou, Chongjian [2 ]
Zu, Fangqiu [1 ]
机构：
[1] Hefei Univ Technol, Sch Mat Sci & Engn, Hefei 230009, Peoples R China
[2] Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
来源：
SCRIPTA MATERIALIA | 2016年 / 118卷
基金：
中国国家自然科学基金;
关键词：
Thermoelectric materials; Electroless plating; Annealing; Hydrogen absorption; Spark plasma sintering; THERMOPOWER; SB;
D O I：
10.1016/j.scriptamat.2016.03.006
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Copper coated Bi0.5Sb1.5Te3 powders were prepared through electroless plating with simplified pretreatment method. After hydrogen reduction, the powders are consolidated into bulk by spark plasma sintering. The lowest lattice thermal conductivity in Bi0.5Sb1.5Te3/Cu reduces to 025 W/m.K at 371.5 K after annealing. The figure of merit (ZT) of Bi0.5Sb1.5Te3/Cu ascends in a large scale and reaches 1.08 at 373 K and 423 K before and after annealing respectively. The average ZT values of Bi0.5Sb1.5Te3/Cu samples both rise from 0.36 to 0.82, which makes this material suitable for application in a wide temperature range. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码：19 / 23
页数：5
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