A control method to reduce the standard deviation of flow time in wafer fabrication

被引:17
作者
Yoon, HJ [1 ]
Lee, DY [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, Taejon 305701, South Korea
关键词
flow time (cycle time); scheduling; stochastic petri nets (SPN); wafer fabrication;
D O I
10.1109/66.857950
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper proposes a control method for reducing flow time variability in a wafer fabrication facility with multiple wafer types. We employ stochastic petri nets to model and analyze the machine module, and define operation due dates using a novel utilization index metric. An operation due date (OPNDD) rule for lot dispatch is proposed and evaluated against other tot dispatch policies.
引用
收藏
页码:389 / 392
页数:4
相关论文
共 8 条
[1]   PERFORMANCE EVALUATION OF AUTOMATED MANUFACTURING SYSTEMS USING GENERALIZED STOCHASTIC PETRI NETS [J].
ALJAAR, RY ;
DESROCHERS, AA .
IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION, 1990, 6 (06) :621-639
[2]  
CHUNG SH, 1997, IEEE T COMPON PACK T, V20, P278
[3]   Due-date based scheduling and control policies in a multiproduct semiconductor wafer fabrication facility [J].
Kim, YD ;
Kim, JU ;
Lim, SK ;
Jun, HB .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1998, 11 (01) :155-164
[4]   EFFICIENT SCHEDULING POLICIES TO REDUCE MEAN AND VARIANCE OF CYCLE-TIME IN SEMICONDUCTOR MANUFACTURING PLANTS [J].
LU, SCH ;
RAMASWAMY, D ;
KUMAR, PR .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1994, 7 (03) :374-388
[5]  
MOLLOY MK, 1982, IEEE T COMPUT, V31, P913, DOI 10.1109/TC.1982.1676110
[6]   CONWIP - A PULL ALTERNATIVE TO KANBAN [J].
SPEARMAN, ML ;
WOODRUFF, DL ;
HOPP, WJ .
INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 1990, 28 (05) :879-894
[7]   A REVIEW OF PRODUCTION PLANNING AND SCHEDULING MODELS IN THE SEMICONDUCTOR INDUSTRY PART I: SYSTEM CHARACTERISTICS, PERFORMANCE EVALUATION AND PRODUCTION PLANNING [J].
UZSOY, R ;
LEE, CY ;
MARTINVEGA, LA .
IIE TRANSACTIONS, 1992, 24 (04) :47-60
[8]   SCHEDULING SEMICONDUCTOR WAFER FABRICATION [J].
WEIN, LM .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1988, 1 (03) :115-130