Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope

被引:30
|
作者
Nakamura, M [1 ]
Sumomogi, T [1 ]
Endo, T [1 ]
机构
[1] Hiroshima Kokusai Gakuin Univ, Fac Engn, Hiroshima 7390321, Japan
来源
SURFACE & COATINGS TECHNOLOGY | 2003年 / 169卷
关键词
atomic force microscopy; grinding; silicon;
D O I
10.1016/S0257-8972(03)00133-6
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Nano-scale machining by ultra precision Grinding and cutting, known as ductile mode machining, has the potential of overcoming limitations of conventional machining technology. In this study, the nano-scale layers of single crystal silicon and Glass surface were machined by a sharply pointed diamond tool, and the subsurface cracks as well as the surface cracks were observed by a scanning force microscope and a scanning laser microscope. The transition point determined by the subsurface cracks is found to be shallower than that by the surface cracks. Therefore the evaluation of the subsurface cracks is important especially in finish machining. (C) 2003 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:743 / 747
页数:5
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