Revealing silicon crystal defects by conductive atomic force microscope

被引:15
|
作者
Liu, Xiaoxiao [1 ]
Yu, Bingjun [1 ]
Zou, Yijia [1 ]
Zhou, Chao [1 ]
Li, Xiaoying [2 ]
Wu, Jiang [3 ]
Liu, Huiyun [3 ]
Chen, Lei [1 ]
Qian, Linmao [1 ]
机构
[1] Southwest Jiaotong Univ, Minist Educ, Key Lab Adv Technol Mat, Tribol Res Inst, Chengdu 610031, Sichuan, Peoples R China
[2] Univ Birmingham, Sch Met & Mat, Birmingham B15 2TT, W Midlands, England
[3] UCL, Dept Elect & Elect Engn, Torrington Pl, London WC1E 7JE, England
基金
中国国家自然科学基金;
关键词
PHASE-TRANSFORMATIONS; SINGLE; NANOINDENTATION; SI; NANOFABRICATION; PRESSURE; BEHAVIOR; SURFACE; GE;
D O I
10.1063/1.5044518
中图分类号
O59 [应用物理学];
学科分类号
摘要
The machining and polishing of silicon can damage its surface. Therefore, the investigation of the electric performance of the processed surface is of paramount importance for understanding and improving the utilization of silicon components with nanoscale crystal defects. In this study, conductivity of nanoscratches on the silicon surface was investigated using a conductive atomic force microscope. Compared to the original silicon surface (without any treatment), electrical breakover at low bias voltage could be detected on the mechanically scratched area of the silicon surface with crystal defects, and the current increased with the voltage. In contrast, no obvious current was found on the defect-free scratch created by tribochemical removal. The conductivity could also be observed on a friction-induced protrusive hillock created at high speed but not on a hillock created at low speed that is constructed by amorphous silicon. Further analysis showed that lattice distortions could facilitate easy electron flow and contributed significantly to the conductivity of a mechanical scratch on the silicon surface; however, the amorphous layer hardly contributed to the conductivity, which was also supported by high resolution transmission electron microscope analysis. As a result, the relationship between the electrical performance and microstructures was experimentally established. These findings shed new light on the subtle mechanism of defect-dependent conductivity and also provide a rapid and nondestructive method for detecting surface defects. Published by AIP Publishing.
引用
收藏
页数:5
相关论文
共 50 条
  • [41] IMAGING MOLECULAR DEFECTS IN ALKANETHIOL MONOLAYERS WITH AN ATOMIC-FORCE MICROSCOPE
    BUTT, HJ
    SEIFERT, K
    BAMBERG, E
    JOURNAL OF PHYSICAL CHEMISTRY, 1993, 97 (28): : 7316 - 7320
  • [42] Study of leakage defects on GaN films by conductive atomic force microscopy
    Moore, J. C.
    Ortiz, J. E.
    Xie, J.
    Morkoc, H.
    Baski, A. A.
    PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NANOSCIENCE AND TECHNOLOGY, 2007, 61 : 90 - 94
  • [43] Atomic force microscope
    不详
    MICRO, 1995, 13 (10): : 22 - 22
  • [44] THE ATOMIC FORCE MICROSCOPE
    GOH, MC
    MARKIEWICZ, P
    CHEMISTRY & INDUSTRY, 1992, (18) : 687 - 691
  • [45] Growth of single gold nanofilaments at the apex of conductive atomic force microscope tips
    Bakhti, S.
    Destouches, N.
    Hubert, C.
    Reynaud, S.
    Vocanson, F.
    Ondarcuhu, T.
    Epicier, T.
    NANOSCALE, 2016, 8 (14) : 7496 - 7500
  • [46] Reliability of Electronic Devices: Nanoscale Studies Based on the Conductive Atomic Force Microscope
    Lanza, Mario
    2016 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2016, : XIV - XIV
  • [47] ATOMIC FORCE MICROSCOPE
    TSUDA, N
    INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING, 1991, 25 (04): : 253 - 258
  • [48] Atomic force microscope
    不详
    MICRO, 1995, 13 (02): : 46 - 46
  • [49] Electromechanical Characterization of Single GaN Nanobelt Probed with Conductive Atomic Force Microscope
    X. Y. Yan
    J. F. Peng
    S. A. Yan
    X. J. Zheng
    Journal of Electronic Materials, 2018, 47 : 3869 - 3875
  • [50] Electromechanical Characterization of Single GaN Nanobelt Probed with Conductive Atomic Force Microscope
    Yan, X. Y.
    Peng, J. F.
    Yan, S. A.
    Zheng, X. J.
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (07) : 3869 - 3875