Multi-I/O and reconfigurable RF/wireless interconnect based on near field capacitive coupling and multiple access techniques

被引：13

作者：

Chang, MF ^{[1
]}

Roychowdhury, V ^{[1
]}

Zhang, LY ^{[1
]}

Zhou, SN ^{[1
]}

Wang, ZY ^{[1
]}

Wu, YC ^{[1
]}

Ma, PX ^{[1
]}

Lin, CS ^{[1
]}

Kang, ZJ ^{[1
]}

机构：

[1] Univ Calif Los Angeles, High Speed Lab, Dept Elect Engn, Los Angeles, CA 90095 USA

来源：

PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2000年

关键词：

D O I：

10.1109/IITC.2000.854269

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Future ULSI interconnect system demands extremely high data transmission rate, multi-I/O service, reconfigurable and fault-tolerant computing/processing architecture and full compatibility with mainstream silicon CMOS and MCM technologies. In this paper, we present a novel RF/wireless interconnect system that provides a unique solution to those system needs. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on near-field capacitive coupling, low loss and dispersion-free microwave signal transmission and modern multiple-access algorithms. The proposed RF/wireless interconnect promises ultra-broad bandwidth (up to 100GHz), simultaneous multi-I/O communications (up to 50/50 I/O sub-channels per shared microwave transmission medium) and reconfigurable network (programmable based on Frequency and/or Code Division Multiple Access). As the first step to prove the feasibility, we have realized a 2x2 CDMA transceivers based on 0.35 mu m MOSIS CMOS process, which demonstrates the desired functions of capacitive coupling, guided wave transmission and reconfigurable multiple access.

引用

页码：21 / 22

页数：2