Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses

Electrolytic copper foils with different thicknesses were prepared by adjusting the electrodeposition time and controlling other electrolytic parameters to be constant. SEM, XRD, EBSD, and universal testing machine were used to research the effects of surface morphology, texture, size effect and fracture mechanism on the tensile properties of electrolytic copper foil with different thicknesses. The results show that with the increase of electrodeposition time, the grain size of the surface increases, and the orientation of the crystal plane {220} becomes stronger. When the copper foil thickness is less than 18 mu m, the tensile strength and elongation of the ultra-thin copper foils increase with the thickness of the copper foil increasing due to the size effect. However, when the thickness of the copper foil is more than 18 mu m, as the thickness of the copper foil increases, the grain size becomes larger and the degree of crystal plane orientation becomes higher, which reduces the tensile strength of the copper foil.