Optical Interconnection Technology for the Next Generation Supercomputers

被引：0
|
作者：
Sakai, J. [1 ]
Noda, A. [1 ]
Yamagishi, M. [2 ]
Ohtsuka, T. [3 ]
Sunaga, K. [3 ]
Sugita, H. [3 ]
Ono, H. [1 ]
Yashiki, K. [1 ]
Kouta, H. [1 ]
机构：
[1] NEC Corp Ltd, Nano Elect Res Labs, Nakahara Ku, 1753 Shimonumabe, Kawasaki, Kanagawa 2118666, Japan
[2] NEC Engn Ltd, Technol Dev Div, Kawasaki, Kanagawa, Japan
[3] NEC Corp Ltd, Device Platforms Res Lab, Sagamihara, Kanagawa, Japan
来源：
HIGH PERFORMANCE COMPUTING ON VECTOR SYSTEMS 2009 | 2010年
关键词：
D O I：
10.1007/978-3-642-03913-3_5
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This article describes the new optical interconnection technology which would be indispensable to realize high throughput supercomputer. To achieve 20 Gbps signal transmission between two LSIs of the supercomputer, we have developed every necessary component of optical interconnect system such as vertical-cavity surface-emitting laser (VCSEL), PIN-photodiodes (PD), electrical transmission line, driver IC and receiver IC. Each device is designed to optimize high speed signal characteristics of throughout transmission system. With these components total transmission system between two LSIs is developed and 20-Gbps 100 m signal transmission is successfully demonstrated. This transmission system is applicable to actual supercomputer.
引用
收藏
页码：53 / +
页数：2
相关论文
共 50 条
  • [21] Editorial: Next Generation Technologists for Next Generation Technology
    Currie, G. M.
    RADIOGRAPHY, 2023, 29 (03) : 625 - 626
  • [22] OPTICAL INTERCONNECTION FOR ULSI TECHNOLOGY INNOVATION
    IWATA, A
    OPTOELECTRONICS-DEVICES AND TECHNOLOGIES, 1994, 9 (01): : 39 - 54
  • [23] Static Evaluation of a Midimew Connected Torus Network for Next Generation Supercomputers
    Al-Shammari, Maryam
    Haque, Asrar
    Rahman, M. M. Hafizur
    SUSTAINABILITY, 2023, 15 (08)
  • [24] ORMOCER®s for optical interconnection technology
    Buestrich, R
    Kahlenberg, F
    Popall, M
    Dannberg, P
    Müller-Fiedler, R
    Rösch, O
    JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, 2001, 20 (02) : 181 - 186
  • [25] MOEMS -: Technology, packaging and optical interconnection
    Schröder, H
    Scheel, W
    FUNCTIONAL INTEGRATION OF OPTO-ELECTRO-MECHANICAL DEVICES AND SYSTEMS, 2001, 4284 : 122 - 131
  • [26] ORMOCER®s for Optical Interconnection Technology
    R. Buestrich
    F. Kahlenberg
    M. Popall
    P. Dannberg
    R. Müller-Fiedler
    O. Rösch
    Journal of Sol-Gel Science and Technology, 2001, 20 : 181 - 186
  • [27] Optical interconnection technology for PCB applications
    Griese, Elmar
    Printed Circuit Fabrication, 2002, 25 (06): : 20 - 36
  • [28] Next generation approach to solve interconnection problem in Bangladesh
    Choudhury, N. H.
    Gupta, S. N.
    IETE TECHNICAL REVIEW, 2006, 23 (06) : 367 - 374
  • [29] Versatile Z-Axis Interconnection-Based Coreless Technology Solutions for Next Generation Packaging
    Das, R. N.
    Egitto, F. D.
    Lauffer, J. M.
    Chenelly, Evan
    Polliks, M. D.
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1728 - 1733
  • [30] Development of Next Generation Flip Chip Interconnection Technology using Homogenized Laser-Assisted Bonding
    Jung, Yanggyoo
    Ryu, Dongsu
    Gim, Minho
    Kim, Choonghoe
    Song, Yunseok
    Kim, Jinyoung
    Yoon, Juhoon
    Lee, Choonheung
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 88 - 94
12345