Cryogenic Characterization of 16 nm FinFET Technology for Quantum Computing

被引:8
作者
Han, Hung-Chi [1 ]
Jazaeri, Farzan [1 ]
D'Amico, Antonio [1 ]
Baschirotto, Andrea [2 ]
Charbon, Edoardo [1 ]
Enz, Christian [1 ]
机构
[1] Ecole Polytech Fed Lausanne EPFL, Lausanne, Switzerland
[2] Univ Milano Bicocca, Milan, Italy
来源
IEEE 51ST EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2021) | 2021年
基金
欧盟地平线“2020”;
关键词
Tri-gate FinFET; Cryogenic CMOS; Quantum Computing; Compact Modeling; MOBILITY; CMOS;
D O I
10.1109/ESSDERC53440.2021.9631805
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study presents the first in depth characterization of deep cryogenic electrical behavior of a commercial 16nm CMOS FinFET technology. This technology is well suited for a broad range of applications, including quantum computing, quantum sensing, and quantum communications. Cryogenic DC measurements and physical parameters extraction were carried out on this commercial FinFET technology, operating at room temperature, i.e., 300 K, and down to 2.95K for different device types and geometries. This represents the main step towards cryogenic compact modeling and optimization of three-dimensional CMOS structures for quantum computations.
引用
收藏
页码:71 / 74
页数:4
相关论文
共 24 条
  • [21] ON THE UNIVERSALITY OF INVERSION LAYER MOBILITY IN SI MOSFETS .1. EFFECTS OF SUBSTRATE IMPURITY CONCENTRATION
    TAKAGI, S
    TORIUMI, A
    IWASE, M
    TANGO, H
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (12) : 2357 - 2362
  • [22] TEMPERATURE DEPENDENCE OF ENERGY GAP IN SEMICONDUCTORS
    VARSHNI, YP
    [J]. PHYSICA, 1967, 34 (01): : 149 - &
  • [23] Single dopant impact on electrical characteristics of SOI NMOSFETs with effective length down to 10nm
    Wacquez, R.
    Vinet, M.
    Pierre, M.
    Roche, B.
    Jehl, X.
    Cueto, O.
    Verduijn, J.
    Tettamanzi, G. C.
    Rogge, S.
    Deshpande, V.
    Previtali, B.
    Vizioz, C.
    Pauliac-Vaujour, S.
    Comboroure, C.
    Bove, N.
    Faynot, O.
    Sanquer, M.
    [J]. 2010 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2010, : 193 - +
  • [24] Wang J, 2002, INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, P707, DOI 10.1109/IEDM.2002.1175936