Identifying key process characteristics and predicting etch rate from High-Dimension Datasets

被引：15

作者：

Ragnoli, E. ^{[1
]}

McLoone, S. ^{[1
]}

Lynn, S. ^{[1
]}

Ringwood, J. ^{[1
]}

Macgearailt, N. ^{[2
]}

机构：

[1] NUI Maynooth, Dept Elect Engn, Maynooth, Kildare, Ireland

[2] Dublin City Univ, Dublin 9, Ireland

来源：

2009 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE | 2009年

关键词：

D O I：

10.1109/ASMC.2009.5155966

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In semiconductor manufacturing advanced process control (APC) refers to a range of techniques that can be used to improve process capability. As the dimensions of electronic devices have decreased, the application of APC has become more and more important for the critical stages of production processes. However, the economic disadvantage of employing APC is that it requires feedback information in the form of downstream metrology data, which is both time consuming and costly to obtain.

引用

页码：106 / +

页数：3