Recent progress in SLID bonding in novel 3D-IC technologies

被引：86

作者：

Sun, Lei ^{[1
]}

Chen, Ming-he ^{[1
]}

Zhang, Liang ^{[2
,3
]}

He, Peng ^{[3
]}

Xie, Lan-sheng ^{[1
]}

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing 210016, Peoples R China

[2] Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China

[3] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2020年 / 818卷

基金：

中国国家自然科学基金;

关键词：

SLID bonding; Solder/(Cu; Ni; Co; Ag; Au); substrate; Interfacial reactions; Microstructure evolution; LEAD-FREE SOLDERS; INTERMETALLIC COMPOUND GROWTH; CU-SN MICROJOINTS; INTERFACIAL REACTIONS; MICROSTRUCTURE EVOLUTION; MECHANICAL-PROPERTIES; CHIP-STACKING; PHASE-TRANSFORMATION; BUMP METALLIZATION; GRAIN-ORIENTATION;

D O I：

10.1016/j.jallcom.2019.152825

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential bonding method applied to 3D chip stacking because it can be bonded at a low temperature and used in a high temperature. In this paper, the interfacial reactions and microstructure evolution between different substrates (Cu, Ni, Co, Ag, Au, etc.) and interlayer materials (Sn, In, SnIn, Ga) through SLID bonding in 3D-IC package interconnects were systematically reviewed. The addition of alloys/particles to the intermediate layer material to improve the voids in solder joints was also discussed. In addition, the application of SLID bonding technique, the formation of intermetallic compounds and microstructure evolution at the interface as well as the reliability of solder joints obtained by SLID were presented. (C) 2019 Elsevier B.V. All rights reserved.

引用

页数：18

共 122 条

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