Interface diffusion and mechanical properties of ODS-W/Cu prepared by spark plasma sintering

In the absence of an intermediate layer, ODS-W (W-2%Y2O3) and copper (Cu) powders were successfully combined by spark plasma sintering (SPS) in the temperature range of 850 degrees C-980 degrees C. In this paper, the microstructure of the joints at different temperatures was investigated by SEM, EDS, and TEM, and the phase composition of the bonded joints was studied by XRD. The effects of sintering temperature on diffusion distance and physical mechanical properties were analyzed. The diffusion distances of Cu and W increased as the bonding temperature increased. At 980 degrees C, no microcracks and pores were formed at the joint of ODS-W/Cu, and the mutual diffusion distance between W and Cu was the longest, reaching 1.3 um. When yttrium oxide started to emerge near the ODS-W/Cu joint, the diffusion distance between W and Cu increased. In addition, at 980 degrees C, the ODS-W/Cu connector has a great difference compared with other temperatures, with the tensile strength up to 312 MPa and hardness up to 200 H V.