Vacuum diffusion bonding of TiB2 cermet to TiAl based alloys

被引：9
|
作者：
Li, ZR [1 ]
Feng, JC [1 ]
Cao, J [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2004年 / 20卷 / 12期
关键词：
titanium boride ceramic; titanium aluminide; diffusion bonding;
D O I：
10.1179/026708304225016798
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Vacuum diffusion bonding of TiB2 cermet to TiAl based alloys was carried out at 1123-1323 K for 0.6-3.6 ks under 80 MPa. The microstructural analyses indicate that a compound Ti(Cu,Al)(2) is formed in the interface of the TiB2/TiAl joints, and the width and quantity of the Ti(Cu,Al)(2) compound increase with the increase of the bonding temperature and bonding time. The experimental results show that the shear strength of the diffusion bonded TiB2/TiAl joint is 103 MPa, when TiB2 cermet is bonded to TiAl based alloy at 1223 K for 1.8 ks under 80 MPa.
引用
收藏
页码：1666 / 1668
页数：3
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