Fully automated hot embossing processes utilizing high resolution working stamps

被引：11

作者：

Glinsner, T. ^{[1
]}

Veres, T. ^{[2
]}

Kreindl, G. ^{[1
]}

Roy, E. ^{[2
]}

Morton, K. ^{[2
]}

Wieser, T. ^{[1
]}

Thanner, C. ^{[1
]}

Treiblmayr, D. ^{[1
]}

Miller, R. ^{[3
]}

Lindner, P. ^{[1
]}

机构：

[1] EVGrp, A-4782 St Florian, Austria

[2] Natl Res Council Canada, Inst Ind Mat, Boucherville, PQ J4B 6Y4, Canada

[3] EVGroup Inc, Tempe, AZ 85284 USA

来源：

MICROELECTRONIC ENGINEERING | 2010年 / 87卷 / 5-8期

关键词：

Hot embossing; Soft working stamps; De-embossing; Spin-on layer; High resolution; LITHOGRAPHY;

D O I：

10.1016/j.mee.2009.11.098

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Nanoimprint lithography (NIL) is a fast replication technology for structures with sizes ranging from micrometer down to few nanometers range. This paper describes the technology for imprinting of polymer substrates as well as spin-on polymers by using soft working stamp materials. A fully automated hot embossing system, the EVG (R) 750 was built to use this rapid replication processes. By utilizing soft working stamps, we demonstrate the possibility to replicate, in fully automated mode, both high-aspect ratio features in thermoplastic materials as needed for microfluidic lab-on-chip applications as well as high resolution features down to 50 nm in polymer that can be used as templates for pattern transfer in the fabrication of plasmonic substrates for bio-sensing applications. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：1037 / 1040

页数：4

共 7 条

[1] High resolution lithography with PDMS molds [J].

Bender, M ;

Plachetka, U ;

Ran, J ;

Fuchs, A ;

Vratzov, B ;

Kurz, H ;

Glinsner, T ;

Lindner, F .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (06) :3229-3232

[2] Surface modification of thermoplastics - towards the plastic biochip for high throughput screening devices [J].

Diaz-Quijada, Gerardo A. ;

Peytavi, Regis ;

Nantel, Andre ;

Roy, Emmanuel ;

Bergeron, Michel G. ;

Dumoulin, Michel M. ;

Veres, Teodor .

LAB ON A CHIP, 2007, 7 (07) :856-862

[3]

DORSEY P, DISCRETE TRACK RECOR

[4] The use of automatic demolding in nanoimprint lithography processes [J].

Merino, S. ;

Schift, H. ;

Retolaza, A. ;

Haatainen, T. .

MICROELECTRONIC ENGINEERING, 2007, 84 (5-8) :958-962

[5]

Mizuno Jun, 2004, P 9 INT C COMM MICR, P389

[6]

NEIL S, 2005, MATER RES SOC S P, P872

[7] Nanoimprint Lithography with a commercial 4 inch bond system for hot embossing [J].

Roos, N ;

Luxbacher, T ;

Glinsner, T ;

Pfeiffer, K ;

Schulz, H ;

Scheer, HC .

EMERGING LITHOGRAPHIC TECHNOLOGIES V, 2001, 4343 :427-435

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