Transient liquid phase (TLP) bonding of TiAl using various insert foils

被引:21
作者
Duan, H [1 ]
Koçak, M
Bohm, KH
Ventzke, V
机构
[1] GKSS Forschungszentrum Geesthacht GmbH, Inst Mat Res, D-21502 Geesthacht, Germany
[2] Beijing Univ Aeronaut & Astronaut, Beijing 100083, Peoples R China
关键词
diffusion brazing; intermetallics; interface structure;
D O I
10.1179/136217104225021850
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
TiAl intermetallic alloys have been joined using the diffusion brazing technique with Ti insert foil metal combined with Cu, Ni or Fe foils. Defect-free joints can be fabricated successfully, no matter which kind of foil combination is used as insert metal. The interface structures of the joints were also investigated and results showed various interface structures in the joined zones. A mechanism for the development of the interface structure is proposed. It is suggested that the formation process of the liquid phase was responsible for the resulting interface structures. Post-bond heat treatment (PBHT) had no obvious effect on the interface structure of the joints because of the low diffusion coefficient of Cu, Ni and Fe in the parent material. Microhardness results showed a slight decrease in the joint area as a result of PBHT.
引用
收藏
页码:513 / 518
页数:6
相关论文
共 16 条
[1]   Transient liquid phase diffusion bonding under a temperature gradient: Modelling of the interface morphology [J].
Assadi, H ;
Shirzadi, AA ;
Wallach, ER .
ACTA MATERIALIA, 2001, 49 (01) :31-39
[2]  
Butts DA, 2003, TRENDS IN WELDING RESEARCH, PROCEEDINGS, P495
[3]   Diffusion bonding of investment cast γ-TiAl [J].
Çam, G ;
Koçak, M .
JOURNAL OF MATERIALS SCIENCE, 1999, 34 (14) :3345-3354
[4]  
Çam G, 1999, Z METALLKD, V90, P284
[5]  
Fergus JW, 2003, TRENDS IN WELDING RESEARCH, PROCEEDINGS, P799
[6]   A microstructural investigation of NiAl/Ni-Si-B/NiAl transient liquid phase bonds [J].
Gale, WF ;
Orel, SV .
JOURNAL OF MATERIALS SCIENCE, 1996, 31 (02) :345-349
[7]   Transient liquid-phase bonding in the NiAl/Cu/Ni system - A microstructural investigation [J].
Gale, WF ;
Guan, Y .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1996, 27 (11) :3621-3629
[8]  
HANSEN PM, 1958, METALLURGY METALLURG
[9]   Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints [J].
Kim, JJ ;
Park, JW ;
Eagar, TW .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 344 (1-2) :240-244
[10]  
MACDONALD WD, 1992, TRANSIENT LIQUID PHA, P93