A study on thermomechanical deformation of elastic beam with embedded shape memory alloy wires

被引：31

作者：

Sun, GJ

Sun, SS

Wu, XD

Wu, JS

机构：

[1] Shanghai Jiao Tong Univ, Dept Engn Mech, Shanghai 200030, Peoples R China

[2] Shanghai Jiao Tong Univ, Dept Mat Sci, Shanghai 200030, Peoples R China

来源：

MATERIALS & DESIGN | 2000年 / 21卷 / 06期

关键词：

curvature of beam; embedded SMA wires; electrical current profile; transient heat transfer;

D O I：

10.1016/S0261-3069(00)00005-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The bending deformation of an elastic beam with eccentrically embedded shape memory alloy (SMA) wires under the activation of electrical current has been investigated. A procedure, which accounts for the effect of transient heat transfer and gives rise to the beam bending responding to prescribed input electrical current profile is used for analysis. It is found that influences of ambient temperature, electric current intensity and prestrain of SMA on the bending deformation of beam are significant. (C) 2000 Elsevier Science Ltd. All rights reserved.

引用

页码：525 / 528

页数：4

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