A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging

被引：0

作者：

Ghisi, Aldo ^{[1
]}

Mariani, Stefano ^{[1
]}

Corigliano, Alberto ^{[1
]}

Allegato, Giorgio ^{[2
]}

Oggioni, Laura ^{[2
]}

机构：

[1] Politecn Milan, Dipartimento Ingn Civile & Ambientale, I-20133 Milan, Italy

[2] STMicroelectronics, AMS MEMS Technol Dev, I-20864 Agrate Brianza, Italy

来源：

MICROELECTRONICS RELIABILITY | 2014年 / 54卷 / 9-10期

关键词：

Metallic bonding; Multi-scale approach; Surface roughness; SENSORS SUBJECT; SURFACE;

D O I：

10.1016/j.microrel.2014.07.054

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work we present a numerical, multi-scale approach to estimate the strength of a wafer-to-wafer metallic thermo-compression bonding. Following a top-down approach, the mechanical problem is handled at three different length scales. Taking into account control variables such as temperature, overall applied force over the wafer and contact surface roughness, it is shown that the proposed approach is able to provide an estimate of the sealing properties, especially in terms of bonding strength. (C) 2014 Elsevier Ltd. All rights reserved.

引用

页码：2039 / 2043

页数：5