The status of lead-free solder alloys

被引:0
作者
Seelig, K [1 ]
Suraski, D [1 ]
机构
[1] AIM Inc, Cranston, RI USA
来源
ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM | 2000年
关键词
This paper will discuss and compare several lead-free solder alloys with each other and with the; traditional tin/lead alloy and provide process advice for the implementation of these solders;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The issue of lead-free soldering has gripped the electronics assembly industry as of late. What was once something that appeared to be toofar away to worry about now has become a pressing reality. In order to avoid confusion, panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals, it is necessary for all suppliers and assemblers to become educated in this matter. There currently exist several lead-free allolys deemed "acceptable" for various applications. However, it is important to note that many differences occur from alloy to alloy, and much research and background information is required before the successful implementation of a lead-free solder. This paper shall provide a comparison of the tin-silver, tin-copper, and tin-silver-copper alloys with each other and the tin-lead alloy, and well as process advice for the implementation of these solders and an overview of where the industry stands on the issue today.
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页码:36 / 41
页数:6
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