High Thermal Sintering Die Attach for Power Device

被引：0

作者：

Seong, Kyeongsool ^{[1
]}

Iwasaki, Toshihiro ^{[1
]}

Nakamura, Takashi ^{[1
]}

Sakumoto, Shotaro ^{[1
]}

Taniguchi, Fumihiko ^{[1
]}

机构：

[1] J Devices Co, Packaging Res & Dev Ctr, Kanagawa Ku, 1-1-32 Shinurashima Cho, Yokohama, Kanagawa, Japan

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

关键词：

Sintering process; Power device packaging; High thermal and electrical conductance property;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Solder paste material is widely used for power devices as a standard die attach adhesive. But current solder paste material is not suitable to support high power devices which are requiring large current and high voltage application because it has low thermal and electrical conductance property. The characteristics of good die attach material should have high thermal conductance and low coefficient of thermal expansion (CTE) to minimize thermo-mechanical stresses, high electrical conductance to handle large current, high temperature stability, high mechanical strength and resistance to fatigue failure. Solders of the Pb-Sn and Lead-free have relatively low electrical and thermal conductivity. We have performed evaluations to find optimum material with silver sintering concept to replace solder paste.

引用

页码：341 / 344

页数：4