Development of Vision System for Defect Inspection of Electric Parts in the Tape and Reel Package

被引：0

作者：

Lee, Ji Yeon ^{[1
]}

Han, Chang Ho ^{[1
]}

Ko, Kuk Won ^{[1
]}

Lee, Sangjoon ^{[1
]}

机构：

[1] Sunmoon Univ, Sch Mech & ICT Convergence Engn, Asan, Chungnam, South Korea

来源：

2016 16TH INTERNATIONAL CONFERENCE ON CONTROL, AUTOMATION AND SYSTEMS (ICCAS) | 2016年

基金：

新加坡国家研究基金会;

关键词：

Vision inspection; Tape and reel package packaging; Multi thread and parallel inspection; Chip defect inspection;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Tape and reel packaging process is one of the important final manufacturing process of electric chip. During and after this packaging process, the defects of chips in the tape and reel package should be inspected. It is so time and cost consuming task by human inspectors. The main defects of chip in the tape and reel package are orientation chip, a wrong type chip and marking defects of chips. In this paper, the automatic vision system and image processing algorithms are developed to inspect the above defects on tape and reel packaging process. The high speed vision algorithm is based on multi-thread and parallel processing method to meet the inspection time(minimum 200 chips/min). Experiments were performed to evaluate the proposed vision inspection algorithms. The experimental result shows that our algorithm achieves high accuracy and speed for industrial requirement.

引用

页码：437 / 439

页数：3