Thermal roughening restrained by bulk chemical order:: Cu-Pd(17%)(115) versus Cu(115) and Cu3Au(1112) surfaces

被引：8
作者：
Le Goff, E
Barbier, L
Garreau, Y
Sauvage, M
机构：
[1] CEA Saclay, DSM DRECAM SPCSI, F-91191 Gif Sur Yvette, France
[2] LURE Univ, F-91000 Orsay, France
来源：
SURFACE SCIENCE | 2003年 / 522卷 / 1-3期
关键词：
scanning tunneling microscopy; X-ray scattering; diffraction; and reflection; surface structure; morphology; roughness; and; topography; surface roughening; step formation and bunching; copper; palladium; gold; alloys; stepped single crystal surfaces; vicinal single crystal surfaces;
D O I：
10.1016/S0039-6028(02)02341-5
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
In contrast with dense surfaces, pure metal vicinal surfaces exhibit a roughening transition temperature well below their melting point. Although the surface structure of the single step Cu-Pd(17%)(I 15) and Cu(I 15) is similar, it is pointed out that the two surfaces have a very different behavior for thermal step disordering. If the roughening temperature of Cu(I 15) is found to be of 380 K, the alloy surface does not roughen up to the vicinity of the bulk chemical order-disorder transition (T-c = 778 K). This result point out the interest of ordered alloys to produce high temperature stable flat surfaces. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码：143 / 160
页数：18
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