Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability

被引：3

作者：

Ishikawa, Shinji ^{[1
]}

Uchiyama, Tomoyuki ^{[1
]}

Hashino, Eiji ^{[1
]}

Kohno, Taro ^{[1
]}

Tanaka, Masamoto ^{[1
]}

Tatsumi, Kohei ^{[1
]}

机构：

[1] Nippon Steel Corp Ltd, Adv Technol Res Labs, 20-1 Shintomi, Futtsu, Chiba 2938511, Japan

来源：

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS | 2007年

关键词：

D O I：

10.1109/ECTC.2007.373901

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-mu m pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/Cu-UBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to, various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

引用

页码：872 / +

页数：2

共 3 条

[1] Micro-ball wafer bumping for flip chip interconnection [J].

Hashino, E ;

Shimokawa, K ;

Yamamoto, Y ;

Tatsumi, K .

51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, :957-964

[2]

Jurenka C, 2005, ELEC COMP C, P89

[3] Improvement in drop shock reliability of Sn-1.2Ag-0.5Cu BGA interconnects by Ni addition [J].

Tanaka, Masamoto ;

Sasaki, Tsutomu ;

Kobayashi, Takayuki ;

Tatsumi, Kohei .

56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, :78-+

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