Solder bump fabricated with molten 63Sn37Pb droplet on Au/Ni/Cu pad

被引：0

作者：

Li, FQ ^{[1
]}

Wang, CQ ^{[1
]}

Liu, DM ^{[1
]}

Liu, P ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China

来源：

PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON NEW FORMING TECHNOLOGY | 2004年

关键词：

solder droplet; intermetallic; contact temperature; FEM;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au/Ni/Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the calculation have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).

引用

页码：567 / 572

页数：6