Solder bump fabricated with molten 63Sn37Pb droplet on Au/Ni/Cu pad

被引：0
|
作者：
Li, FQ [1 ]
Wang, CQ [1 ]
Liu, DM [1 ]
Liu, P [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China
来源：
PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON NEW FORMING TECHNOLOGY | 2004年
关键词：
solder droplet; intermetallic; contact temperature; FEM;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au/Ni/Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the calculation have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).
引用
收藏
页码：567 / 572
页数：6
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