Influence of the Cu content on the electrochemical corrosion performances of Ni60 coating

被引:50
作者
Yang, Xiaotian [1 ]
Zeng, Rong [1 ]
Fu, Xiaoyue [2 ]
Wang, Xinhua [1 ]
Zhou, Jun [1 ]
Yu, Lun [1 ]
机构
[1] Lanzhou Univ Technol, Sch Mat & Engn, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
[2] Lanzhou Coll Informat Sci & Technol, Sch Mat & Chem Engn, Lanzhou 730050, Peoples R China
关键词
Ni60; Cu composite coatings (A); Directional structure (C); Corrosion resistance (C); NI-BASED ALLOY; PITTING CORROSION; HEAT-TREATMENT; BEHAVIOR; RESISTANCE; PHASE; FILM; MICROSTRUCTURE; OXYGEN; STEEL;
D O I
10.1016/j.corsci.2022.110408
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of element Cu on microstructures and corrosion behavior of the directional structure Ni-based coatings were investigated experimentally. The element Cu enhanced the orientation growth of the coating microstructures, and the coating of Ni60/5 %Cu exhibited the highest corrosion potential (-0.236 V) and the smallest current density (1.238 x10-6A/cm2). The corrosion resistance of the coating declined with increased Cu content, when the content of Cu reached 20 %, the corrosion potential and current density of the coating dropped to 0.380 V and 2.100 x 10-6A/cm2, respectively, but they were still better than that of the coating without Cu element, which were - 0.395 V and 2.858 x 10-5A/cm2, respectively.
引用
收藏
页数:12
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