Thermodynamic properties of the liquid Ag-Cu-Sn lead-free solder alloys

被引：8
作者：
Kopyto, Marek [1 ]
Onderka, Boguslaw [2 ]
Zabdyr, Leszek A. [1 ]
机构：
[1] Polish Acad Sci, Lab Phys Chem Mat, Inst Met & Mat Sci, PL-30059 Krakow, Poland
[2] AGH Univ Sci & Technol, Fac Nonferrous Met, Dept Phys Chem & Electrochem, PL-30059 Krakow, Poland
来源：
MATERIALS CHEMISTRY AND PHYSICS | 2010年 / 122卷 / 2-3期
关键词：
Electrochemical techniques; Thermodynamic properties; Alloys; Electronic materials; GIBBS FREE-ENERGY; PHASE-EQUILIBRIA; EMF-MEASUREMENTS; TERNARY-SYSTEMS; TIN; SILVER; OXYGEN; TEMPERATURE; PREDICTION; SOLUBILITY;
D O I：
10.1016/j.matchemphys.2010.03.030
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The electromotive force measurement method was employed to determine the thermodynamic properties of liquid Ag-Cu-Sn alloys using solid electrolyte galvanic cells as shown below: Kanthal + Re. Ag-Cu-Sn, SnO2 vertical bar Yttria stabilized Zirconialair. Pt, p(o2) = 0.21 atm Measurements were carried out for three cross-sections with constant Ag/Cu ratio equal to: 1/3, 1 and 3 and for tin compositions ranging from 10 up to 80 at.%, every 10%, resulting in a total of 24 different alloy compositions. The temperature of the measurements varied within the range from 973 to 1325K. A linear dependence of the e.m.f. on temperature was observed for all alloy compositions and the appropriate line equations were derived. Tin activities were calculated as function of composition and temperature. Results were presented in tables and figures. (C) 2010 Elsevier B.V. All rights reserved.
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收藏
页码：480 / 484
页数：5
相关论文
共 29 条
  • [1] THERMODYNAMICS AND SOLUBILITY OF OXYGEN IN LIQUID METALS FROM EMF MEASUREMENTS INVOLVING SOLID ELECTROLYTES .2. TIN
    BELFORD, TN
    ALCOCK, CB
    [J]. TRANSACTIONS OF THE FARADAY SOCIETY, 1965, 61 (507P): : 443 - &
  • [2] CARBONOVER J, 1972, T I MIN MET C, V81, P443
  • [3] An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates
    Chada, S
    Laub, W
    Fournelle, RA
    Shangguan, D
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1194 - 1202
  • [4] Dolet N., 1992, Journal of the European Ceramic Society, V9, P19, DOI 10.1016/0955-2219(92)90072-L
  • [5] Fedorov V N., 1982, Phase Diagrams of Metallic Systems, V26, P149
  • [6] FEDOTOV VN, 1981, FAZOVYE RAVNOVESIYA, P42
  • [7] GEBHARDT E, 1959, Z METALLKD, V50, P597
  • [8] GISBY JA, 531 COST, V1, P175
  • [9] THERMODYNAMIC STUDY OF LIQUID TIN-SILVER ALLOYS BY MEANS OF SOLID-OXIDE GALVANIC CELL
    IWASE, M
    YASUDA, MO
    MIKI, SI
    MORI, T
    [J]. TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1978, 19 (11): : 654 - 660
  • [10] KAMMEL R, 1983, METALL BERL, V2, P141
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