Modeling of spin coating film transfer and hot pressing method in the new LSI fabrication process I - the film transfer process -

In this paper, we describe the dynamics of the filling of spaces between interconnections with a polymeric liquid attached to a rigid plate via an elastic film when the rigid plate is pressed clown at a constant velocity. A set of model equations which can describe the filling process is proposed. By performing Simulations for typical interconnection configurations, it was found that the time required to a achieve the total planarization is controlled by two processes, namely, (i) the filling of spaces between interconnections and (ii) the flattening of the interface between the polymeric liquid and elastic film. It was found that the time necessary to achieve the flattening of the top surface of the liquid film becomes constant as the velocity of pressing the top rigid plate becomes larger.