共 50 条
- [1] An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (01): : 161 - 168
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- [3] The Effect of Solder Paste Volume on Chip Resistor Solder Joint Fatigue Life 29TH INTERNATIONAL CONFERENCE ON FLEXIBLE AUTOMATION AND INTELLIGENT MANUFACTURING (FAIM 2019): BEYOND INDUSTRY 4.0: INDUSTRIAL ADVANCES, ENGINEERING EDUCATION AND INTELLIGENT MANUFACTURING, 2019, 38 : 1372 - 1380
- [4] Design of solder joint for self-alignment in optical fiber attachment soldering ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 333 - 337
- [7] Improved Modeling for Solder Joint Geometry and Self-Alignment in Flip Chip Bonding 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 747 - 752
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