Strategies of RC delay reduction in 45 nm BEOL technology

被引:12
作者
Kudo, H. [1 ]
Ochimizu, H. [1 ]
Tsukune, A. [1 ]
Okano, S. [1 ]
Naitou, K. [2 ]
Sakamoto, M. [1 ]
Takesako, S. [2 ]
Shirasu, T. [2 ]
Asneil, A. [2 ]
Idani, N. [2 ]
Sugimoto, K. [2 ]
Ozaki, S. [1 ]
Nakata, Y. [1 ]
Owada, T. [2 ]
Watatani, H. [2 ]
Ohara, N. [2 ]
Ohtsuka, N. [1 ]
Sunayama, M. [1 ]
Sakai, H. [2 ]
Oryoji, M. [1 ,2 ]
Akiyama, S. [2 ]
Iwata, H. [2 ]
Yamamoto, H. [2 ]
Shimoda, Y. [2 ]
Yao, T. [2 ]
Suda, S. [1 ]
Suzuki, T. [1 ]
Sakai, S. [1 ]
Kitada, H. [1 ]
Amari, S. [2 ]
Tabira, T. [1 ]
Matsuura, A. [1 ]
Iba, Y. [2 ]
Mizushima, Y. [1 ]
Matsuyama, H. [2 ]
Suzuki, Y. [2 ]
Shimizu, N. [2 ]
Yanai, K. [2 ]
Nakaishi, M. [2 ]
Futatsugi, T. [1 ]
Hanyu, I. [1 ]
Nakamura, T. [1 ]
Sugii, T. [1 ]
机构
[1] Fujitsu Labs Ltd, 50 Fuchigami, Tokyo 1970833, Japan
[2] Fujitsu Ltd, Tokyo 1970833, Japan
来源
PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2007年
关键词
D O I
10.1109/IITC.2007.382383
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
According to the 45 nm BEOL technology node, we demonstrated that a homogeneous interlayer dielectric with dielectric constant of 2.25 has' a substantial advantage in terms of RC delay reduction compared to other potential architectures such as hybrid and tri-level dielectrics. Combination of the homogeneous interlayer dielectric and ultra-thinned barrier metal lowered the RC delay to 86% compared to that listed in the ITRS 2006 update.
引用
收藏
页码:178 / +
页数:2
相关论文
共 3 条
[1]  
KUDO H, 2000, P IITC, V270
[2]  
SAKAI H, 2006, MRS ADV METALLIZATIO, V33
[3]  
SUGIURA I, 2005, P IITC