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- [2] Effect of a titanium interlayer on the performance of the titanium nitride diffusion barrier MATERIALS RELIABILITY IN MICROELECTRONICS IX, 1999, 563 : 21 - 26
- [6] Direct Copper Electrodeposition on Novel CoMo Diffusion Barrier 2015 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND 2015 IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE (IITC/MAM), 2015, : 127 - 129
- [7] STEP BARRIER FOR INTERLAYER-DIFFUSION IN FE/FE(100) EPITAXIAL-GROWTH PHYSICAL REVIEW B, 1995, 52 (19): : 13801 - 13804