Evaluating the Impact of Optical Interconnects on a Multi-Chip Machine-Learning Architecture

被引:3
|
作者
Ro, Yuhwan [1 ]
Lee, Eojin [1 ]
Ahn, Jung Ho [1 ]
机构
[1] Seoul Natl Univ, Dept Transdisciplinary Studies, Seoul 08826, South Korea
关键词
machine learning; accelerator; optical interconnect; multi-chip architecture; cluster; Convolutional Neural Network (CNN);
D O I
10.3390/electronics7080130
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Following trends that emphasize neural networks for machine learning, many studies regarding computing systems have focused on accelerating deep neural networks. These studies often propose utilizing the accelerator specialized in a neural network and the cluster architecture composed of interconnected accelerator chips. We observed that inter-accelerator communication within a cluster has a significant impact on the training time of the neural network. In this paper, we show the advantages of optical interconnects for multi-chip machine-learning architecture by demonstrating performance improvements through replacing electrical interconnects with optical ones in an existing multi-chip system. We propose to use highly practical optical interconnect implementation and devise an arithmetic performance model to fairly assess the impact of optical interconnects on a machine-learning accelerator platform. In our evaluation of nine Convolutional Neural Networks with various input sizes, 100 and 400 Gbps optical interconnects reduce the training time by an average of 20.6% and 35.6%, respectively, compared to the baseline system with 25.6 Gbps electrical ones.
引用
收藏
页数:11
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