Synthesis of silver nanorods and application for die attach material in devices

被引：12

作者：

Jiu, Jinting ^{[1
]}

Murai, Keiichi ^{[1
]}

Kim, Keunsoo ^{[1
]}

Suganuma, Katsuaki ^{[1
]}

机构：

[1] Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2010年 / 21卷 / 07期

关键词：

LOW-TEMPERATURE; POLYOL SYNTHESIS; NANOSTRUCTURES; NANOPARTICLES; PASTE; SHAPE;

D O I：

10.1007/s10854-009-9983-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silver nanorods have been successfully synthesized in high yield by a polyol process in the presence of FeCl(3). The yield and morphology of the silver particles from these conditions were dependant on the concentration of FeCl(3), and the molar ratio of the capping agent to AgNO(3). The optimized conditions for the synthesis of the nanorods were: 20 mu M of FeCl(3) and a molar ratio of 1.8:1 of capping agent to AgNO(3). The nanorods produced were used to form a silver layer at 400 A degrees C with a low electrical resistivity of 6.1 x 10(-6) Omega cm. The silver layer was applied as die-attachment films to connect a SiC chip to a copper substrate. This formed a porous structure, which was evaluated for structure and strength.

引用

页码：713 / 718

页数：6

共 16 条

[1] Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material [J].