A differential high-speed digital CMOS buffer with hysteresis for improved noise immunity

被引:0
作者
Secareanu, RM [1 ]
Friedman, EG [1 ]
机构
[1] Motorola Inc, Semicond Prod Sector, Digital DNA Labs, ASRL Adv Circuits Res Grp, Tempe, AZ 85284 USA
来源
13TH ANNUAL IEEE INTERNATIONAL ASIC/SOC CONFERENCE, PROCEEDINGS | 2000年
关键词
D O I
10.1109/ASIC.2000.880758
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A digital CMOS buffer circuit with a voltage transfer characteristic (VTC) with low threshold voltages, hysteresis, and high noise immunity is presented. The circuit is capable of restoring slow transition times and distorted input signals with a minimum delay penalty, offering high noise immunity to glitches induced either through capacitive coupling or from the power supply lines such as simultaneous switching noise (SSN). The high noise immunity of the proposed buffer circuit is achieved using a differential redundant circuit architecture.
引用
收藏
页码:326 / 329
页数:4
相关论文
共 10 条
  • [1] ADLER V, 1998, IEEE T CIRCUITS CAS, V45
  • [2] ADLER V, 1997, P AS C SIGN SYST COM, P749
  • [3] di/dt noise in CMOS integrated circuits
    Larsson, P
    [J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 1997, 14 (1-2) : 113 - 129
  • [4] Lee KM, 1998, SOLID STATE TECHNOL, V41, P85
  • [5] PATTON R, 1998, ELECT J OCT, P14
  • [6] CLOSED-FORM EXPRESSIONS FOR INTERCONNECTION DELAY, COUPLING, AND CROSSTALK IN VLSIS
    SAKURAI, T
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (01) : 118 - 124
  • [7] Noise immunity of digital circuits in mixed-signal smart power systems
    Secareanu, RM
    Kourtev, IS
    Becerra, J
    Watrobski, TE
    Morton, C
    Staub, W
    Tellier, T
    Friedman, EG
    [J]. NINTH GREAT LAKES SYMPOSIUM ON VLSI, PROCEEDINGS, 1999, : 314 - 317
  • [8] SECAREANU RM, 1999, P IEEE INT S POW SEM, P253
  • [9] SECAREANU RM, 1999, P IEEE INT C EL CIRC, P205
  • [10] EFFECT OF CMOS DRIVER LOADING CONDITIONS ON SIMULTANEOUS SWITCHING NOISE
    VAIDYANATH, A
    THORODDSEN, B
    PRINCE, JL
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (04): : 480 - 485