Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

被引：0

作者：

Xu, Hua ^{[1
]}

Lo, Jeffery C. C. ^{[2
]}

Lee, S. W. Ricky ^{[1
,2
]}

机构：

[1] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Clear Water Bay, Hong Kong, Peoples R China

[2] Hong Kong Univ Sci & Technol, HKUST Foshan Res Inst Smart Mfg, Kowloon, Clear Water Bay, Hong Kong, Peoples R China

来源：

2020 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2020年

关键词：

Microchannels; Carbon Nanotubes; Reliability; Failure Analysis;

D O I：

10.1109/ipfa49335.2020.9261020

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Cross-sectioning plays an important role in failure analysis. However, commonly used polishing method affects the bonded silicon microchannels and face-to-face interlaced carbon nanotubes (CNTs). Polishing damages the edge of the microchannels and the debris from polishing may be trapped in the microchannels. This paper proposes a novel cross-sectioning technique to realize precise cross-sectioning while maintaining the integrity of bonded silicon microchannels and face-to-face interlaced CNTs. Result shows intact cross-sectioning of the microchannels and CNTs inside.

引用

页数：4

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