The influence of bath temperature on the one-step electrodeposition of non-wetting copper oxide coatings

Currently, the use of smart surfaces in the industries is well developed due to enhanced durability and qualification of fabricated layers as well as the increased values of products. Herein, the hydrophobic copper and cuprite surfaces were fabricated via the electrodeposition at various bath temperatures ranging from 15 to 90 degrees C by galvanostatic and cyclic voltammetry approaches. The layers were grown in the Cu2O (1 1 1) and Cu (0 0 2) directions in the galvanostatic and cyclic voltammetry methods, respectively which are in agreement with the SEM images of surface crystals. In fact, in the galvanostatic samples, triangles and octahedral pyramids were formed in the size of 100 to 600 mu m while the 1 to 61 mu m crystals with flat facets were formed using the cyclic voltammetry. In general, the size and swelling of the crystals are increased by raising the bath temperature. Actually, the higher hydrophobicity was observed in the prepared sample at 75 degrees C using cyclic voltammetry where the water droplet adhered to the surface (parahydrophobic) with a large contact angle (theta(w) = 147 degrees). This sample was also converted to superhydrophobic with a small sliding angle (theta(SA) < 3 degrees) after one year rest in a sealed glass box.