High-Performance Polycrystalline Silicon TFT on the Structure of a Dopant-Segregated Schottky-Barrier Source/Drain

被引:14
作者
Choi, Sung-Jin [1 ]
Han, Jin-Woo [1 ]
Kim, Sungho [1 ]
Moon, Dong-Il [1 ]
Jang, Moongyu [2 ]
Choi, Yang-Kyu [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Div Elect Engn, Sch Elect Engn & Comp Sci, Taejon 305701, South Korea
[2] ETRI, Taejon 305700, South Korea
关键词
Dopant-segregated Schottky barrier (DSSB); dopant segregation (DS); high performance; MOSFET; Ni silicide; Schottky barrier (SB); thin body; thin-film transistors (TFTs); POLY-SI; TECHNOLOGY; TRANSISTOR; FILMS;
D O I
10.1109/LED.2009.2038348
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high-performance polycrystalline silicon (poly-Si) thin-film transistor (TFT) with Schottky-barrier (SB) source/drain (S/D) junctions is proposed. A p-channel operation on the intrinsic nickel (Ni) silicided S/D was successfully realized with the aid of a thin active layer, despite the fact that the Ni silicided material shows a high SB height (SBH) for holes. Furthermore, for n-channel operation, the dopant-segregation technique implemented on the intrinsic Ni silicide was utilized to reduce the effective SBH for electrons. The results show a higher on-current due to the lower parasitic resistance as well as superior immunity against short-channel effects, compared to the conventional poly-Si TFT composed of p-n S/D junctions.
引用
收藏
页码:228 / 230
页数:3
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