Modeling of Thermal Transport in Pillared-Graphene Architectures

被引:277
作者
Varshney, Vikas [1 ,3 ]
Patnaik, Soumya S. [2 ]
Roy, Ajit K. [1 ]
Froudakis, George [4 ]
Farmer, Barry L. [1 ]
机构
[1] AF Res Lab, Mat & Mfg Directorate, Dayton, OH USA
[2] AF Res Lab, Prop Directorate, Dayton, OH USA
[3] Universal Technol Corp, Dayton, OH USA
[4] Univ Crete, Dept Chem, Khania, Greece
关键词
pillared-graphene; carbon nanotubes; graphene; molecular dynamics; thermal transport; phonon scattering; thermal management; MOLECULAR-DYNAMICS SIMULATION; HEAT-CONDUCTION;
D O I
10.1021/nn901341r
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Carbon nanotubes (CNT) and graphene are considered as potential future candidates for many nano/microscale integrated devices due to their superior thermal properties. Both systems, however, exhibit significant anisotropy in their thermal conduction, limiting their performance as three-dimensional thermal transport materials. From thermal management perspective, one way to tailor this anisotropy is to consider designing alternative carbon-based architectures. This paper investigates the thermal transport in one such novel architecture-a pillared-graphene (PG) network nanostructure which combines graphene sheets and carbon nanotubes to create a three-dimensional network. Nonequilibrium molecular dynamics simulations have been carried out using the AIREBO potential to calculate the thermal conductivity of pillared-graphene structures along parallel (in-plane) as well as perpendicular (out-of-plane) directions with respect to the graphene plane. The resulting thermal conductivity values for PG systems are discussed and compared with simulated values for pure CNT and graphite. Our results show that in these PG structures, the thermal transport is governed by the minimum interpillar distance and the CNT-pillar length, This is primarily attributed to scattering of phonons occurring at the CNT-graphene junctions in these nanostructures. We foresee that such architecture could potentially be used as a template for designing future structurally stable microscale systems with tailorable in-plane and out-of-plane thermal transport.
引用
收藏
页码:1153 / 1161
页数:9
相关论文
共 56 条
[1]   The thermal conductivity and thermal rectification of carbon nanotubes studied using reverse non-equilibrium molecular dynamics simulations [J].
Alaghemandi, Mohammad ;
Algaer, Elena ;
Boehm, Michael C. ;
Mueller-Plathe, Florian .
NANOTECHNOLOGY, 2009, 20 (11)
[2]   An overview of advances in heat conduction models and approaches for prediction of thermal conductivity in thin dielectric films [J].
Anderson, CVDR ;
Tamma, KK .
INTERNATIONAL JOURNAL OF NUMERICAL METHODS FOR HEAT & FLUID FLOW, 2004, 14 (01) :12-65
[3]   Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films [J].
Angadi, Maki A. ;
Watanabe, Taku ;
Bodapati, Arun ;
Xiao, Xingcheng ;
Auciello, Orlando ;
Carlisle, John A. ;
Eastman, Jeffrey A. ;
Keblinski, Pawel ;
Schelling, Patrick K. ;
Phillpot, Simon R. .
JOURNAL OF APPLIED PHYSICS, 2006, 99 (11)
[4]   Superior thermal conductivity of single-layer graphene [J].
Balandin, Alexander A. ;
Ghosh, Suchismita ;
Bao, Wenzhong ;
Calizo, Irene ;
Teweldebrhan, Desalegne ;
Miao, Feng ;
Lau, Chun Ning .
NANO LETTERS, 2008, 8 (03) :902-907
[5]   Unusually high thermal conductivity of carbon nanotubes [J].
Berber, S ;
Kwon, YK ;
Tománek, D .
PHYSICAL REVIEW LETTERS, 2000, 84 (20) :4613-4616
[6]   Molecular dynamics simulation of thermal conductivity of single-wall carbon nanotubes [J].
Bi, KD ;
Chen, YF ;
Yang, JK ;
Wang, YJ ;
Chen, MH .
PHYSICS LETTERS A, 2006, 350 (1-2) :150-153
[7]   Carbon nanotube composites for thermal management [J].
Biercuk, MJ ;
Llaguno, MC ;
Radosavljevic, M ;
Hyun, JK ;
Johnson, AT ;
Fischer, JE .
APPLIED PHYSICS LETTERS, 2002, 80 (15) :2767-2769
[8]   A second-generation reactive empirical bond order (REBO) potential energy expression for hydrocarbons [J].
Brenner, DW ;
Shenderova, OA ;
Harrison, JA ;
Stuart, SJ ;
Ni, B ;
Sinnott, SB .
JOURNAL OF PHYSICS-CONDENSED MATTER, 2002, 14 (04) :783-802
[9]   Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates [J].
Cao, Qing ;
Kim, Hoon-sik ;
Pimparkar, Ninad ;
Kulkarni, Jaydeep P. ;
Wang, Congjun ;
Shim, Moonsub ;
Roy, Kaushik ;
Alam, Muhammad A. ;
Rogers, John A. .
NATURE, 2008, 454 (7203) :495-U4
[10]   Upper bound to the thermal conductivity of carbon nanotube pellets [J].
Chalopin, Yann ;
Volz, Sebastian ;
Mingo, Natalio .
JOURNAL OF APPLIED PHYSICS, 2009, 105 (08)