Effect of cutting tool geometries on the ductile-brittle transition of monocrystalline sapphire

被引:47
作者
Gu, Xingshi [1 ]
Wang, Hao [2 ]
Zhao, Qingliang [1 ]
Xue, Junmin [3 ]
Guo, Bing [1 ]
机构
[1] Harbin Inst Technol, Sch Mech & Elect Engn, Harbin 150001, Heilongjiang, Peoples R China
[2] Natl Univ Singapore, Fac Engn, Dept Mech Engn, 9 Engn Dr 1, Singapore 117575, Singapore
[3] Natl Univ Singapore, Fac Engn, Dept Mat Sci & Engn, 9 Engn Dr 1, Singapore 117575, Singapore
基金
中国国家自然科学基金;
关键词
Monocrystalline sapphire; Cutting tool geometry; Ductile-brittle transition; Coefficient of friction; Stress analysis; UNDEFORMED CHIP THICKNESS; SURFACE QUALITY; PLANE SAPPHIRE; FUSED-SILICA; GRIT; SIMULATION; BEHAVIOR; GRAIN; DEFORMATION; INDENTATION;
D O I
10.1016/j.ijmecsci.2018.09.015
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
This paper investigates the effect of cutting tool geometries on the initiation of ductile-brittle transition (DBT) of monocrystalline sapphire with a series of single-grit scratching tests. According to the method of single factor experiment, four typical geometrical parameters, namely rake angle, apex angle, opening angle, and truncated section, were evaluated in 7 scratching tests. The scratching force, groove topography and critical cutting depth for DBT (DBdc) have been measured by a dynamometer, SEM, and AFM, respectively. Furthermore, a new theoretical model of DBdC with respect to the rake and apex angle is established. The predicted DBdc agrees well with experimental results. The mechanism of the initiation of DBT is further investigated by the coupled SPH-FEM simulation. The research results reveal that all of the four geometrical parameters are the dominant factors with significant impact on the initiation of DBT of sapphire. Without exceeding the critical value, an increase in the negative rake angle contributes to an increased DBdc. The apex angle and opening angle are proved to adversely affect the DM, and give rise to DBT at a smaller cutting depth, though the mechanisms associated with these two parameters are different. The parameter of the truncated section also has a significant effect where the DBdC decreases abruptly and severe brittle fracture is present with an increasing dimension of the truncated section.
引用
收藏
页码:565 / 577
页数:13
相关论文
共 43 条
  • [21] Experimental investigation of material removal mechanism in single grit grinding
    Opoz, Tahsin Tecelli
    Chen, Xun
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2012, 63 : 32 - 40
  • [22] Analysis of the grain shape influence on the chip formation in grinding
    Rasim, Matthias
    Mattfeld, Patrick
    Klocke, Fritz
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2015, 226 : 60 - 68
  • [23] SCHMID F, 1994, P SOC PHOTO-OPT INS, V2286, P2, DOI 10.1117/12.187329
  • [24] Shaw MC., 1984, METAL CUTTING PRINCI, DOI [10.1037/023990, DOI 10.1037/023990]
  • [25] FEM/SPH simulation research and experiment of surface roughness based on traditional polishing process
    Shen Li-Jun
    Wan Yong-Jian
    Meng Kai
    Huang Chuan-Ke
    [J]. OPTICAL REVIEW, 2015, 22 (03) : 393 - 401
  • [26] Novel diamond conditioner dressing characteristics of CMP polishing pad
    Tsai, Ming-Yi
    Chen, Shun-Tong
    Liao, Yunn-Shiuan
    Sung, James
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2009, 49 (09) : 722 - 729
  • [27] Investigation into the anisotropy of cross-grinding surface quality in C- and M-planes of sapphire
    Wang, Jinhu
    Guo, Bing
    Zhao, Qingliang
    Zeng, Zhaoqi
    Zhai, Wenjie
    Chen, Hongxu
    Sun, Jinxia
    [J]. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2019, 233 (01) : 44 - 54
  • [28] Evolution of material removal modes of sapphire under varied scratching depths
    Wang, Jinhu
    Guo, Bing
    Zhao, Qingliang
    Zhang, Chunyu
    Zhang, Quanli
    Zhai, Wenjie
    [J]. CERAMICS INTERNATIONAL, 2017, 43 (13) : 10353 - 10360
  • [29] Dependence of material removal on crystal orientation of sapphire under cross scratching
    Wang, Jinhu
    Guo, Bing
    Zhao, Qingliang
    Zhang, Chunyu
    Zhang, Quanli
    Chen, Hongxu
    Sun, Jinxia
    [J]. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2017, 37 (06) : 2465 - 2472
  • [30] Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions
    Wang, Wei
    Yao, Peng
    Wang, Jun
    Huang, Chuanzhen
    Zhu, Hongtao
    Zou, Bin
    Liu, Hanlian
    Yan, Jiwang
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2016, 109 : 126 - 136