Synergistic Effect of Nano-silica and Micro-silica Fillers on the Rheological Properties of Epoxy Resin

被引:5
作者
Khanum, Khadija Kanwal [1 ]
Kostalas, Andreas [2 ]
Jayaram, Shesha [1 ]
Ulcar, John [2 ]
机构
[1] Univ Waterloo, 200 Univ Ave W, Waterloo, ON N2L 3G1, Canada
[2] Crosslink Technol Inc, 6380 Viscount Rd, Mississauga, ON L4V 1H3, Canada
来源
2020 IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING | 2020年
基金
加拿大自然科学与工程研究理事会;
关键词
Composites; epoxy resin; mechanical analysis; micro-silica; nano-silica; nanocomposites; thermal analysis; viscosity;
D O I
10.1109/IAS44978.2020.9334856
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study aims to improve nanofiller dispersion in epoxy resins by using the electrostatic disperser (ED) as well as to reduce the cost, by using combination of micro- and nanofillers. The ED method aids in homogenized mixing of nanofillers in epoxy resin, due to its jet elongation and shearing effect on polymer mix. In this context, two concentrations (7.5 wt % and 5 wt %) of nano-silica are used and their rheological properties are tested, before and after the addition of 50 wt% micro-silica. A plausible mechanism of filler dispersion is explained for ED and high shear (HS) methods. It is observed that electrostatic dispersion method aids in network formation of nano-silica, unlike high shear method wherein clusters of nano-silica are formed. Hence ED method aids in reducing the viscosity values with the addition of micro-silica, which is helpful in product molding process. The flexural strength and heat deflection temperature lie in same range for both composites prepared using ED and HS methods.
引用
收藏
页数:4
相关论文
共 10 条
[1]   Mass Production of Nanocomposites Using Electrospinning [J].
Angammana, Chitral J. ;
Gerakopulos, Ryan J. ;
Jayaram, Shesha H. .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2019, 55 (01) :817-824
[2]   Understanding the Influence of Nano Micro Filler on Electrical and Mechanical Behaviour of Epoxy Nanocomposites [J].
Babu, M. Sukesh ;
Sarathi, R. ;
Vasa, N. J. ;
Imai, Takahiro .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2019, 26 (04) :1098-1106
[3]   Electrical Properties Analysis of Micro and Nano Composite Epoxy Resin Materials [J].
Castellon, J. ;
Nguyen, H. N. ;
Agnel, S. ;
Toureille, A. ;
Frechette, M. ;
Savoie, S. ;
Krivda, A. ;
Schmidt, L. E. .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2011, 18 (03) :651-658
[4]  
Guo JL, 2014, PROCEEDINGS OF 2014 INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATING MATERIALS (ISEIM 2014), P441, DOI 10.1109/ISEIM.2014.6870813
[5]  
Hujie Mei, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), P623, DOI 10.1109/ICEPT.2009.5270673
[6]   Effects of nano- and micro-filler mixture on electrical insulation properties of epoxy based composites [J].
Imai, T ;
Sawa, F ;
Nakano, T ;
Ozaki, T ;
Shimizu, T ;
Kozako, M ;
Tanaka, T .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2006, 13 (02) :319-326
[7]   Influence of Filler-Polymer Interface on Performance of Silicone Nanocomposites [J].
Khanum, Khadija Kanwal ;
Sharma, Arathi Mohan ;
Aldawsari, Faisal ;
Angammana, Chitral ;
Jayaram, Shesha H. .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2020, 56 (01) :686-692
[8]   High filler loading technique and its effects on the reliability of epoxy molding compound [J].
Moon, KS ;
Hwang, SD ;
Yoon, HG ;
Ryu, JH ;
Woo, SS .
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, :318-324
[9]  
Okazaki Yuta, 2010, IEEE INT C SOLID DIE
[10]  
Steinzen H., 2001, Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001). 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Electronic Insulating Materials and Applications in Systems (IEEE Cat. No.01TH8544), P187, DOI 10.1109/ISEIM.2001.973603