Novel vertical polysilicon thin-film transistor with excimer-laser annealing

被引:10
作者
Lee, MZ [1 ]
Lee, CL [1 ]
Lei, TF [1 ]
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2003年 / 42卷 / 4B期
关键词
vertical; TFT; VTFT; ELA and self-alignment;
D O I
10.1143/JJAP.42.2123
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this paper, we propose a novel self-alignment vertical thin-film transistor (VTFT) structure with excimer laser annealing (ELA). The ELA on source and drain decreases the process temperature, suppresses the lateral diffusion of dopants in short channel devices and increases the driving current. Furthermore, the VTFTs have high carrier mobility, compared to conventional polysilicon thin film transistors (TFTs).
引用
收藏
页码:2123 / 2126
页数:4
相关论文
共 12 条
[1]   A high-performance polysilicon thin-film transistor using XeCl excimer laser crystallization of pre-patterned amorphous Si films [J].
Cao, M ;
Talwar, S ;
Kramer, KJ ;
Sigmon, TW ;
Saraswat, KC .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (04) :561-567
[2]   ENHANCED CONDUCTIVITY AND BREAKDOWN OF OXIDES GROWN ON HEAVILY IMPLANTED SUBSTRATES [J].
HEGARTY, CJ ;
LEE, JC ;
HU, CM .
SOLID-STATE ELECTRONICS, 1991, 34 (11) :1207-1213
[3]  
Ikeda S., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P469, DOI 10.1109/IEDM.1990.237066
[4]   Advanced source/drain engineering for box-shaped ultrashallow junction formation using laser annealing and pre-amorphization implantation in sub-100-nm SOICMOS [J].
Kim, SD ;
Park, CM ;
Woo, JCS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (10) :1748-1754
[5]  
Lai CS, 1996, IEEE ELECTR DEVICE L, V17, P199, DOI 10.1109/55.491828
[6]   INVERTED THIN-FILM TRANSISTORS WITH A SIMPLE SELF-ALIGNED LIGHTLY DOPED DRAIN STRUCTURE [J].
LIU, CT ;
YU, CHD ;
KORNBLIT, A ;
LEE, KH .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (12) :2803-2809
[7]   EDGE-DEFINED SELF-ALIGNMENT OF SUBMICROMETER OVERLAID DEVICES [J].
MALHI, SDS ;
CHATTERJEE, PK ;
BONIFIELD, TD ;
LEISS, JE ;
CARTER, DE ;
PINIZZOTTO, RF ;
COLEMAN, DJ .
IEEE ELECTRON DEVICE LETTERS, 1984, 5 (10) :428-429
[8]   LEAKAGE CURRENT CHARACTERISTICS OF OFFSET-GATE-STRUCTURE POLYCRYSTALLINE-SILICON MOSFETS [J].
SEKI, S ;
KOGURE, O ;
TSUJIYAMA, B .
IEEE ELECTRON DEVICE LETTERS, 1987, 8 (09) :434-436
[9]   HIGH-PERFORMANCE TFTS FABRICATED BY XECL EXCIMER LASER ANNEALING OF HYDROGENATED AMORPHOUS-SILICON FILM [J].
SERA, K ;
OKUMURA, F ;
UCHIDA, H ;
ITOH, S ;
KANEKO, S ;
HOTTA, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (12) :2868-2872
[10]   CHARACTERISTICS OF OFFSET-STRUCTURE POLYCRYSTALLINE-SILICON THIN-FILM TRANSISTORS [J].
TANAKA, K ;
ARAI, H ;
KOHDA, S .
IEEE ELECTRON DEVICE LETTERS, 1988, 9 (01) :23-25