Electroless deposition of gold using different reducing agents

被引：0

作者：

Djokic, SS ^{[1
]}

机构：

[1] Westaim Biomed Corp, Ft Saskatchewan, AB T8L 3W4, Canada

来源：

FUNDAMENTAL ASPECTS OF ELECTROCHEMICAL DEPOSITION AND DISSOLUTION, PROCEEDINGS | 2000年 / 99卷 / 33期

关键词：

D O I：

暂无

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Electroless deposition of gold onto Ni-B and NI-P surfaces was comparatively investigated using four different solutions. Composition of these solutions differed in the source of gold-salt or in the reducing agent. In the first three solutions, the source of gold salt was KAu(CN)(2). The main differences in these solutions were reducing agents (borohydride, hydrazine or hydrazine sulfate) or operating conditions (pH and temperature). The forth type of solution was a non-cyanide solution, containing ascorbic acid as a reducing agent. Rates of gold deposition as a function of temperature for all investigated solutions were determined. Adhesion, porosity, surface morphology and structure of deposited gold films from all solutions were investigated. The borohydride solution used in the present work was unstable. Using hydrazine in both slightly acidic and alkaline solutions, gold was plated only on Ni-B but not on NI-P surfaces. The deposits of gold films were good in the appearance, but adhesion was poor. Gold films obtained from gold thiosulfate solutions using ascorbic acid as reducing agent were good in appearance. Adhesion and solderability were also good. solutions is also discussed. Surface morphology and structure of gold films obtained from different

引用

页码：381 / 396

页数：16