Development of polyimide-based flexible tactile sensing skin

被引:0
作者
Engel, J [1 ]
Chen, J [1 ]
Liu, C [1 ]
Flachsbart, BR [1 ]
Selby, JC [1 ]
Shannon, MA [1 ]
机构
[1] Univ Illinois, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
来源
ELECTRONICS ON UNCONVENTIONAL SUBSTRATES-ELECTROTEXTILES AND GIANT-AREA FLEXIBLE CIRCUITS | 2003年 / 736卷
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a novel microfabrication process for realizing a new type of flexible sensory "smart skin". In this work, we focus on demonstration of a skin containing a two dimensional array of tactile sensors using polyimide and metal strain gauges. A novel polymer microfabrication approach coupled with surface release methods is demonstrated. The process yields flexible sensory skins in a low cost, efficient manner. Experimental characterization of the devices is also presented. The demonstrated sensors use metal-film strain gauges in a multiplexed two-dimensional array of tactile pixels (taxels) embedded in a polyimide thin film membrane to detect force distribution on the flexible skin. The arrays have been used to image force distributions and could be used with slip-detection friction measurement for robotic gripping application.
引用
收藏
页码:165 / 170
页数:6
相关论文
共 13 条
[1]   A silicon force sensor for robotics and medicine [J].
Beebe, DJ ;
Hsieh, AS ;
Denton, DD ;
Radwin, RG .
SENSORS AND ACTUATORS A-PHYSICAL, 1995, 50 (1-2) :55-65
[2]   A FLEXIBLE POLYIMIDE-BASED PACKAGE FOR SILICON SENSORS [J].
BEEBE, DJ ;
DENTON, DD .
SENSORS AND ACTUATORS A-PHYSICAL, 1994, 44 (01) :57-64
[3]  
CAO L, 1999, P 1999 IEEE S MICR, P204
[4]   Processing thick multilevel polyimide films for 3-D stacked memory [J].
Caterer, MD ;
Daubenspeck, TH ;
Ference, TG ;
Holmes, SJ ;
Quinn, RM .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (02) :189-199
[5]  
Gray BL, 1996, IEEE INT CONF ROBOT, P1, DOI 10.1109/ROBOT.1996.503564
[6]   A flexible MEMS technology and its first application to shear stress sensor skin [J].
Jiang, FK ;
Tai, YC ;
Walsh, K ;
Tsao, T ;
Lee, GB ;
Ho, CM .
MEMS 97, PROCEEDINGS - IEEE THE TENTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND ROBOTS, 1997, :465-470
[7]   A traction stress sensor array for use in high-resolution robotic tactile imaging [J].
Kane, BJ ;
Cutkosky, MR ;
Kovacs, GTA .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (04) :425-434
[8]   OBJECT IMAGING WITH A PIEZOELECTRIC ROBOTIC TACTILE SENSOR [J].
KOLESAR, ES ;
DYSON, CS .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1995, 4 (02) :87-96
[9]   Tactile sensing for mechatronics - a state of the art survey [J].
Lee, MH ;
Nicholls, HR .
MECHATRONICS, 1999, 9 (01) :1-31
[10]   New tactile sensor chip with silicone rubber cover [J].
Leineweber, M ;
Pelz, G ;
Schmidt, M ;
Kappert, H ;
Zimmer, G .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 84 (03) :236-245